Chemical Resistant

Carbon Fiber Reinforced PEEK from Apium, is a material formulated with Carbon Fibers and PEEK. Its high thermal conductivity, enabled thanks to its specific formulation, made CFR PEEK an ideal material for a variety of industries as aerospace or electronic. Create functional prototyping, end-use parts or material development with the CFR PEEK material.

Apium PEEK 450 filament is a highly resistant, semi-crystaline thermoplastic material. It is ideal for applications requiring thermal, chemical, and mechanical exceptional conditions. Industries like Automotive, Aerospace, Medical, Electronics, and Oil & Gas use this material for its excellent characteristics.

CarbonX CF PEKK-A by 3DXTech is a carbon fibre-filled material that has properties comparable to PEEK, but is significantly easier to print. A great PEEK alternative which is ideal for industries such Automotive, Aerospace and Gas + Oil.

CarbonX CF PEEK by 3DXTech combines high-performance PEEK material with 10% carbon fibre to produce an extremely strong filament with improved dimensional stability and excellent chemical resistance.

3DXTech have used premium Sabic Ultem (PEI) polymer and chopped carbon fibres to create an extremely strong and stiff material that is a great lightweight option for replacing metal parts.

One of the PAEK family of high-performance polymers, FibreX™ PEKK-A by 3DXTech has a lower processing temperature than PEEK which makes it easier to print, and after annealing can display even better mechanical, thermal and chemical resistance properties.

FibreX™ PEEK by 3DXTech is one of the highest-performance industrial 3D printing filaments on the market today. Featuring outstanding thermal, mechanical and chemical resistance properties, This filament is ideal for applications in industries such as automotive, aerospace and gas + oil.

3DXTech FibreX™ PPSU is a high-quality filament with excellent thermal and chemical resistance properties, as well as great dimensional stability. An ideal choice for a range of demanding applications.